- E-beam resist
- Glass&quartz wafer
- Micro-fluidic device and Reactor
- 玻璃激光焊接設(shè)備
- Glass&quartz micro-machining
- Micro milling
- Add: Room 1909, TongDianMingJu Building B, No.1 South Street, BaLiQiao, Tongzhou District, Beijing.
- Tel: 010-65479350
- Fax: 010-65479309
- Email: info@ginkoo-mems.com
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WAFER LEVEL PACKAGING（room temperature)
- Product description: WLP（room temperature)
Product introduction
WAFER-LEVEL PACKAGING FOR ULTRA-THIN GLASSES USING HERMETIC ROOM TEMPERATURE WELDING
TECHNOLOGY
鍵合材料 BONGING MATERIALS
- 玻璃－玻璃；玻璃－硅；石英－石英；藍寶石－藍寶石和透明陶瓷
- Glass-glass; glass-Si；quartz-quartz;sapphire-sapphire and transparent ceramics
- 大多數(shù)玻璃（(Borofloat 33, D263, ENA1, 石英等)和硅
- Most glass types （Borofloat 33, D263, ENA1, fused silica etc.)and Silicon
材料厚度 MATERIALS THICKNEES
- 頂層晶圓材料厚度：50μm－2mm
- Top wafer material thickness 50μm –2mm
- 底層晶圓材料厚度：最大30mm
- Bottom material thickness: Up to 30 mm
材料大小： MATERIALS SIZE
- 直徑：100-200mm
- Diameter:100-200mm
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